Physical Vapor Deposition – PVD technology

Inline coating system with dual magnetron for reactive Al<sub>2</sub>O<sub>3</sub> deposition.
© Fraunhofer IST, Falko Oldenburg
Inline coating system with dual magnetron for reactive Al2O3 deposition.

Our technologies in the field of physical vapor deposition (PVD)

In physical vapor deposition (PVD), the coating material is present in liquid or solid form inside the vacuum chamber. The material is transferred to the gas phase atomically, either as a molecule or as a cluster, reaches the substrate surface through kinetic (physical) movement and is deposited (condensed) there.

 

Magnetron sputtering

 

High-power impulse magnetron sputtering

 

Hollow cathode processes