Special Equipment

The Fraunhofer IST has a well-equipped coating center for the manufacturing of prototypes and pilot series. Here we provide you with an overview of our equipment.

• a-C:H:Me, a-C:H, hard coating production plant (up to 3 m3 volume)
• Coating facilities incorporating magnetron and RF diode sputtering
• Sputter plant for high-precise optical coatings
• In-line coating facility for large-surface optical functional coatings (up to 60 × 100 cm2)
• Industrial scale HIPIMS technology
• Plants for plasma diffusion
• Coating systems for hollow cathode processes
• Coating plant for thermal and plasma atomic layer deposition (ALD) (2D and 3D)
• Hot-filament-CVD units for crystalline diamond coatings (up to 50 × 100 cm2) and for internal coatings
• Hot-filament-CVD unit for silicon-based coatings (batch process and run-through process up to 50 x 60 cm2)
• Plasma-activated CVD (PACVD) units, combined with plasma nitriding
• Atmospheric pressure plasma systems for coating and functionalization of large areas (up to 40 cm widths)
• Microplasma plants for selective functionalization of surfaces (up to Ø = 20 cm)
• Bond aligner with an integrated plasma tool for wafer pretreatment in the clean room
• Roll-to-roll set-up for area-selective functionalization of surfaces up to 10 m / min
• Machine for internal coating of bags or bottles
• Laser for 2D and 3D microstructuring
• Automated system for deposition of polyelectrolyte
• 2 mask aligner for photolithographic structuring
• Laboratory for microstructuring (40 m2 clean room)
• System for electroplating metallization of waveguides
• 15-stage cleaning unit for surface cleaning on aqueous basis
• Clean room – large area coating (25 m2)
• Clean room – sensor technology (35 m2)
• Laser structuring laboratory (17 m2)
• Mobile atmospheric pressure plasma sources
• Nanosecond dye laser (Nd: YAG-Laser)
• CO2-laser and Excimer-Laser
• EUV spectrography
• Semiconductor laser
• Picosecond laser
• Energy-dispersive X-ray spectroscopy (EDX)
• SEM with focussed ion beam (FIB)
• Electron microprobe (WDX, EPMA)
• Secondary ion mass spectrometry (SIMS)
• X-ray diffractometer (XRD, XRR)
• X-ray photoelectron spectroscopy (XPS)
• X-ray fluorescence analysis (RFA / XRF)
• Glow discharge optical emission spectroscopy (GDOES)
• Confocal laser microscope (CLM)
• Scanning tunnel and atomic force microscope (STM, AFM)
• FTIR microscope