Structured deposition

In the field of 3D-MID technology and macro-sensors, the direct structured deposition of functional films is realized using the active mask process. Conductor widths of at least 500 μm can be achieved here. Plasma printing technology operating under atmospheric pressure supports the selective, continuous generation of structure sizes up to a few tens of μm on foil surfaces. Wet chemistry metallization enables the application of ultra-fine conductors in a subsequent step.