Conference Program

Preliminary Schedule

In this section you will find the current planning stage of the conference schedule.

You have the opportunity to shape the scientific program by signing up for a talk or poster via the link on the right.

  WEDnesday, dec 4 Thursday, dec 5 friday, dec 6
7:45   Registration  
8:15 Short Course Welcome  
8:30  Invited Talk 1 Invited Talk 3
9:15  Session 1 Session 3
11:30  Lunch Lunch Lunch
13:00 Short Course Invited Talk 2 Invited Talk 4
13:45 Session 2 Session 4
15:30 Poster Session Closing Ceremony with Poster Prizes
16:30 Company Tour  
19:30   Conference Dinner  

Conference Fees




UNTIL NOV. 11, 2019


AFTER NOV. 11, 2019


350 €

350 €


375 €

425 €


250 €

250 €


175 € (students)

275 € 

175 € (students)

275 €  

Invited Speaker

Coating scientists, technologists, and managers will be invited to present papers at the conference:


Prof. Jyh-Wei Lee Jeff, Taiwan Association for Coating and Thin Film Technology (TACT)

”Fabrication of chromium carbide coatings by reactive sputtering- roles of power supply system and target poisoning” (Abstract)


Dr. Marco Jupé, Laser Zentrum Hannover

Atomistic simulations of reactive deposition processes (Abstract)


Dr. Lucia Mendizabal, IK4Tekniker

Coating development by reactive sputtering for energy related applications” (Abstract)


Dr. Holger Pröhl, VON ARDENNE GmbH

”Reactive magnetron sputtering, challenges in industrial and large area coating systems” (Abstract)



Short Course

”Reactive Magnetron Sputter Deposition”


Reactive magnetron sputter deposition is a mature technique often used in laboratories and at industrial level to grow compound thin films. The growth of these films is defined by the deposition conditions, and therefore a good knowledge of the deposition process is essential to tune the growth and as such the film properties. After a short introduction on the physics of sputtering, the magnetron discharge and the transport of sputtered atoms through the gas phase, the course starts with a few definitions regarding reactive sputtering to show that the processes driving this technique are general applicable. This introduction assists the attendee to the next step: the description of the most common experiment during reactive magnetron sputtering, the hysteresis experiment. The simplicity of this experiment fools initially the scientist because it hides a complex interplay between different processes that define the actual outcome of the experiment. During the course, the details of this experiment are analyzed, and modelling is used to guide the attendee. In this way, the attendee will gain knowledge in a wealth of important process controlling the film growth. A good knowledge of these processes will arm the attendee to analyze and to control the reactive sputtering process.

Course Objectives

  • Understand the fundamental processes driving (reactive) magnetron sputtering
  • Develop strategies for dedicated experiments to unravel the complexity of reactive magnetron sputtering
  • To get a good overview of the current literature and modelling techniques
  • Sputtering: physics of sputtering, and transport of sputtered atoms
  • Magnetron discharges : typical features, electron emission, excitation and ionization
  • Hysteresis experiments : what can we learn from this “simple” experiment?
  • Influence of deposition parameters
  • Dynamics of reactive sputter deposition
  • Arcing
  • Discharge voltage behavior
  • Process parameters and thin film growth
  • Questions and answers


Diederik Depla, Professor, Ghent University, Ghent, Belgium